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Proceedings Paper

Adhesion characteristics of alicyclic polymers for use in ArF excimer laser lithography
Author(s): Kaichiro Nakano; Shigeyuki Iwasa; Katsumi Maeda; Etsuo Hasegawa
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Paper Abstract

We evaluate the adhesion characteristics and relationship between work of adhesion and structure of polar-alicyclic polymers we developed for use in ArF excimer laser lithography. We found that the adhesion of the polymers and resists in both the alkaline-developer and water circumstances depends on the work of adhesion in air. Stronger adhesion can be obtained with higher polarity of polymer films caused by the higher surface free energy due to hydrogen bonds. The polarity of polymers and functional groups is evaluated with their relative dielectric constants. With the standard developer (2.38% tetramethylammonium hydroxide aqueous solution), the chemically amplified resist based on poly(carboxy- tetracyclo[4.4.0.12,5.17,10]dodecylacrylate- co-hydroxy-tricyclo[5.2.1.02,6]decylacrylate) forms a 0.18-micrometers L&S pattern by the ArF excimer laser dose.

Paper Details

Date Published: 29 June 1998
PDF: 10 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312438
Show Author Affiliations
Kaichiro Nakano, NEC Corp. (Japan)
Shigeyuki Iwasa, NEC Corp. (Japan)
Katsumi Maeda, NEC Corp. (Japan)
Etsuo Hasegawa, NEC Corp. (Japan)


Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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