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Proceedings Paper

Deep-ultraviolet antireflective coating with improved conformality, optical density, and etch rate
Author(s): Douglas J. Guerrero; James D. Meador; Gu Xu; Hitoshi Suzuki; Yasuhisa Sone; Vandana N. Krishnamurthy; James B. Claypool; James E. Lamb III
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Paper Abstract

A new bottom antireflective coating (BARC) for 248 nm lithography is described. The new coating has an optical density of approximately 10/micrometers (k equals 0.41 and n equals 1.482) and plasma etches at rates higher than that of DUV resists depending on the etch conditions. Coating conformality is superior to older generation BARCs, also contributing to improved etch dynamics. Excellent 0.25 micrometers features have been obtained with ESCAP, Acetal and t-BOC type photoresists. The new BARC is spin coated from safe solvents and is spin bowl compatible with EBR and photoresist solvents.

Paper Details

Date Published: 29 June 1998
PDF: 8 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312412
Show Author Affiliations
Douglas J. Guerrero, Brewer Science, Inc. (United States)
James D. Meador, Brewer Science, Inc. (United States)
Gu Xu, Brewer Science, Inc. (United States)
Hitoshi Suzuki, Nissan Central Research Institute (Japan)
Yasuhisa Sone, Nissan Central Research Institute (Japan)
Vandana N. Krishnamurthy, Brewer Science, Inc. (United States)
James B. Claypool, Brewer Science, Inc. (United States)
James E. Lamb III, Brewer Science, Inc. (United States)

Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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