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Proceedings Paper

Computational and experimental study of spin coater air flow
Author(s): Xiaoguang Zhu; Faqiu Liang; A. Haji-Sheikh; N. Ghariban
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Paper Abstract

An extensive 2- and 3-D analysis of air flow in a POLARISTM 2200 Microlithography Cluster spin coater was conducted using FLUENTTM Computational Fluid Dynamics (CFD) software. To supplement this analysis, direct measurement of air flow velocity was also performed using a DantecTM Hot Wire Anemometer. Velocity measurements were made along two major planes across the entire flow field in the spin coater at various operating conditions. It was found that the flow velocity at the spin coater inlet is much lower than previously assumed and quite nonuniform. Based on this observation, a pressure boundary condition rather than a velocity boundary condition was used for subsequent CFD analysis. A comparison between calculated results and experimental data shows that the 3D model accurately predicts the air flow field in the spin coater. An added advantage of this approach is that the CFD model can be easily generated from the mechanical design database and used to analyze the effect of design changes. The modeled and measured results show that the flow pattern in the spin bowl is affected by interactions between the spinning wafer, exhaust flow, and the gap between the spin head and surrounding baffle. Different operating conditions such as spin speed, inlet pressure, and exhaust pressure were found to generate substantially different flow patterns. It was also found that backflow of air could be generated under certain conditions.

Paper Details

Date Published: 29 June 1998
PDF: 11 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312396
Show Author Affiliations
Xiaoguang Zhu, FSI International, Inc. (United States)
Faqiu Liang, FSI International, Inc. (United States)
A. Haji-Sheikh, Univ. of Texas/Arlington (United States)
N. Ghariban, Univ. of Texas/Arlington (United States)

Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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