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Proceedings Paper

Thermal stability of silicon-containing methacrylate-based bilayer resist for 193-nm lithography
Author(s): Daniela White; Bernard T. Beauchemin; Andrew J. Blakeney; Thomas Steinhaeusler
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Paper Abstract

Thermal decomposition of silyl substituted methacrylate terpolymers containing acid sensitive groups was studied using thermogravimetric analysis. The onset of decomposition was found to be a function of the microenvironment, i.e. the molar% composition of the acid sensitive group monomer. The Flynn and Wall method of estimating Ea was used to estimate the Ea for decomposition of the terpolymer and where possible, for the acid sensitive group.

Paper Details

Date Published: 29 June 1998
PDF: 12 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312383
Show Author Affiliations
Daniela White, PPG Industries, Inc. (United States)
Bernard T. Beauchemin, Olin Microelectronic Materials, Inc. (United States)
Andrew J. Blakeney, Olin Microelectronic Materials, Inc. (United States)
Thomas Steinhaeusler, Olin Microelectronic Materials, Inc. (United States)


Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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