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Proceedings Paper

Effect of end group on novolak resin properties
Author(s): Anthony Zampini; Michael J. Monaghan; Cheng-Bai Xu; William J. Cardin
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Paper Abstract

Model compounds formed by the reaction of m-cresol with 2,6- bis(hydroxymethyl)-p-cresol, DMPC, were isolated and characterized by 13C NMR. DMPC was found to couple at the 2, 4, and 6-positions of m-cresol at a rate of 12%, 34% and 54% respectively. The condensation reactions of m-cresol and DMPC with 2-hydroxy-3,5-dimethylbenzyl alcohol, 2-HDBA, or 4-hydroxy-3,5-dimethylbenzyl alcohol, 4-HDBA, were determined by 13C NMR to form novolak resins in a manner predicted by model compound data. The introduction of 2,4- dimethylphenol and 2,6-dimethylphenol as specific end-groups to novolak resins was demonstrated to affect both the resin dissolution and photoresist properties. Novolaks end-capped with the more highly o-o' coupled 2,4-dimethylphenol group have lower dissolution rates while the more p-p' coupled, intermolecular oriented, 2,6-dimethylphenol group show higher dissolution rates in TMAH. For the resins investigated, photoresist resolution properties appear to be dictated by the bulk resin structure. Photospeed, however, was greatly enhanced by the 2,6-dimethylphenol end-group. This knowledge was then applied towards the design of novolak resins having built-in dissolution and photospeed promoters, and a novolak/diazonaphthoquinone 0.25 micrometers capable i-line photoresist.

Paper Details

Date Published: 29 June 1998
PDF: 10 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312377
Show Author Affiliations
Anthony Zampini, Shipley Co. Inc. (United States)
Michael J. Monaghan, Shipley Co. Inc. (United States)
Cheng-Bai Xu, Shipley Co. Inc. (United States)
William J. Cardin, Shipley Co. Inc. (United States)


Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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