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Proceedings Paper

Lithographic and chemical contrast of single component top surface imaging (TSI) resists
Author(s): John F. Bohland; Janet Chambers; Siddhartha Das; Theodore H. Fedynyshyn; Susan M. Holl; John M. Hutchinson; Veena Rao; Roger F. Sinta
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Paper Abstract

A variety of different approaches were used in an effort to improve the photospeeds of single component TSI resists based on poly(4-hydroxystyrene). The variations included molecular weights, co-monomer partners, and selected substituents. The factors that were studied dramatically affected silylation rates, in one case by as much as an order of magnitude. However, when the silylation times were adjusted to compensate for the rate differences and silylation depths, only minimal differences in photospeed were observed. The apparent contrast measured by swelling upon silylation was very poor ((gamma) equals 1.5) while the contrast measured after etching was quite high, approximately ten times that of the silylation value.

Paper Details

Date Published: 29 June 1998
PDF: 8 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312375
Show Author Affiliations
John F. Bohland, Shipley Co. Inc. (United States)
Janet Chambers, Intel Corp. (United States)
Siddhartha Das, Intel Corp. (United States)
Theodore H. Fedynyshyn, Shipley Co. Inc. (United States)
Susan M. Holl, Intel Corp. (United States)
John M. Hutchinson, Intel Corp. (United States)
Veena Rao, Intel Corp. (United States)
Roger F. Sinta, Shipley Co. Inc. (United States)


Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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