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Proceedings Paper

Photoresist performance evaluation of implant resist systems
Author(s): David C. Pritchard; Warren Montgomery; James P. Kimball; Jeff A. Albelo
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Paper Abstract

Semiconductor manufacturers continue to look for better techniques to create salable devices. As with any other manufacturing entity, cost effectiveness without sacrificing quality is the key. In photolithographic manufacturing, the elements that drive the cost are raw materials, process time (throughput), and process complexity (number and iterations of process phases). The specific area being addressed by this paper is the implant layers of the semiconductor fabrication process.

Paper Details

Date Published: 29 June 1998
PDF: 23 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312367
Show Author Affiliations
David C. Pritchard, LSI Logic Corp. (United States)
Warren Montgomery, LSI Logic Corp. (United States)
James P. Kimball, LSI Logic Corp. (United States)
Jeff A. Albelo, Ohka America, Inc. (United States)


Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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