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Proceedings Paper

Dry etching resistance of methacrylate polymers for ArF excimer laser lithography
Author(s): Takeshi Ohfuji; Masayuki Endo; Makoto Takahashi; Takuya Naito; Tetsuya Tatsumi; Koichi Kuhara; Masaru Sasago
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Paper Abstract

We have investigated dry-etching resistance of methacrylate polymers for use as ArF chemically amplified resists and proposed a new etching model that can predict the etching rate very accurately. The examined polymers were methacrylate polymers with alicyclic groups. The polymers were dry etched using a LAM TCP-9400 machine under the chlorine-based gas conditions used for poly-silicon etching. The obtained etching rate was explained in term of a carbon- atom-density parameter known as the ohnishi parameter. However, the fitting accuracy is not good enough especially for alicyclic polymers (R equals 0.87). And a ring parameter model also resulted in a similar fitting accuracy (R equals 0.86). Hence, we proposed a new model that introduced polymer-structure dependence into the carbon-atom-density model. The new model gives excellent agreement with measured data (R equals 0.99). And it is very useful in designing ArF resist polymers and predicting etching resistance of future ArF resists.

Paper Details

Date Published: 29 June 1998
PDF: 6 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312363
Show Author Affiliations
Takeshi Ohfuji, Association of Super-Advanced Electronics Technologies (Japan)
Masayuki Endo, Association of Super-Advanced Electronics Technologies (Japan)
Makoto Takahashi, Association of Super-Advanced Electronics Technologies (United States)
Takuya Naito, Association of Super-Advanced Electronics Technologies (Japan)
Tetsuya Tatsumi, Association of Super-Advanced Electronics Technologies (Japan)
Koichi Kuhara, Association of Super-Advanced Electronics Technologies (Japan)
Masaru Sasago, Association of Super-Advanced Electronics Technologies (Japan)


Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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