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Proceedings Paper

Characterization of low-viscosity photoresist coating
Author(s): Murthy S. Krishna; John W. Lewellen; Gary E. Flores
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Paper Abstract

With the semiconductor industry moving towards deeper submicron device geometries, lithography is an increasingly critical step in the semiconductor manufacturing process. This places great emphasis on attaining tighter resist thickness uniformity. Tighter uniformity and elimination of coating anomalies is critical for optimal alignment accuracy and linewidth control. The use of low viscosity photoresists for less than 7000 angstroms film thickness is important due to the higher degree of substrate planarization and need for improved lithographic resolution. The objective of this project was to characterize low viscosity coating characteristics. The work was done on a SVG 90S track system. The viscosities of resists used were less than 10 cp.

Paper Details

Date Published: 29 June 1998
PDF: 14 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312355
Show Author Affiliations
Murthy S. Krishna, Silicon Valley Group, Inc. (United States)
John W. Lewellen, Silicon Valley Group, Inc. (United States)
Gary E. Flores, Silicon Valley Group, Inc. (United States)


Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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