Share Email Print

Proceedings Paper

Deposition of trace metals to a wafer surface from lithography materials
Author(s): Rob W. Ramage; Rita Vos; Marc Meuris; Marcel Lux
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

This paper reports wafer level trace metal concentrations from typical lithography processing and models the process from bulk materials concentrations in order to establish meaningful material specifications. Working from a simple deposition model, we determined the critical volume responsible for a surface metal concentration. Using literature derived spin coat models, we explore how this critical volume can be explained by the spin coat process mechanisms. Results are reported using typical post pattern transfer photoresist removal steps: a photoresist ash step and a sulfuric/peroxide clean. Using the surface level results, a comparison is made to the SIA roadmaps, as well as effects on general transistor characteristics, to draw conclusions on the impact to device performance.

Paper Details

Date Published: 29 June 1998
PDF: 12 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312342
Show Author Affiliations
Rob W. Ramage, Intel Corp. (United States)
Rita Vos, IMEC (Belgium)
Marc Meuris, IMEC (Belgium)
Marcel Lux, IMEC (Belgium)

Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

© SPIE. Terms of Use
Back to Top