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Proceedings Paper

Noncontact ultrasonic ULSI process metrology using ultrafast lasers
Author(s): Robert J. Stoner; Christopher J. Morath; Guray Tas; Samit S. Sengupta; Sailesh M. Merchant; Jeffery B. Bindell; Humphrey J. Maris
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Paper Abstract

Subpicosecond laser ultrasonic techniques have been used for nearly a decade to study the physical and chemical properties of thin films and multilayers. Recent advances in computational methods, optical design and laser technology have made it possible to develop further related techniques for thin film process metrology. In this paper we describe the principles and applications of picosecond ultrasonics, with an emphasis on in-line characterization of metal and dielectric films used in ULSI chip manufacturing. Topics to be discussed include measurements of simple metal films ranging from 50 A to 2 microns thick, and opaque multilayers consisting of up to six sequentially deposited metal films.

Paper Details

Date Published: 8 July 1998
PDF: 9 pages
Proc. SPIE 3269, Commercial Applications of Ultrafast Lasers, (8 July 1998); doi: 10.1117/12.312336
Show Author Affiliations
Robert J. Stoner, Brown Univ. (United States)
Christopher J. Morath, Rudolph Technologies (United States)
Guray Tas, Rudolph Technologies (United States)
Samit S. Sengupta, VLSI Technologies (United States)
Sailesh M. Merchant, Lucent Technologies/Bell Labs. (United States)
Jeffery B. Bindell, Lucent Technologies/Bell Labs. (United States)
Humphrey J. Maris, Brown Univ. (United States)


Published in SPIE Proceedings Vol. 3269:
Commercial Applications of Ultrafast Lasers
Murray K. Reed, Editor(s)

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