Share Email Print
cover

Proceedings Paper

Three-dimensional simulation of oxide-confined vertical-cavity surface-emitting semiconductor lasers
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Several vertical-cavity surface-emitting laser (VCSEL) structures are investigated by means of 3D steady-state electrical-thermal-optical numerical modeling. Electrical and thermal models are coupled via: (i) heat generation by current passing through the diode; (ii) temperature dependence of the diffusion potential of the junction; and (iii) temperature dependence of the bulk resistivity of passive material at both sides of the junction. Optical waveguide model is coupled to electrical-thermal model through position-dependent carrier recombination lifetime and temperature-dependent refractive-index. Simulation is performed for cylindrically symmetric two-sided oxide- confined intracavity-contact VCSELs. For comparison purposes, numerical data are acquired for materially identical bottom-emitting mesa laser and p-side intracavity- contact VCSEL. Nonuniformity of the main device characteristics is studied. Several different phenomena are shown to contribute to nonuniformity: (i) current crowding due to device geometry; (ii) current crowding induced by stimulated emission processes; (iii) current spreading related to oxide positioning; (iv) temperature related effects.

Paper Details

Date Published: 22 June 1998
PDF: 0 pages
Proc. SPIE 3419, Optoelectronic Materials and Devices, 34190Q (22 June 1998); doi: 10.1117/12.311010
Show Author Affiliations
Marek Osinski, Univ. of New Mexico (United States)
Vladimir A. Smagley, Univ. of New Mexico (United States)
Gennady A. Smolyakov, Univ. of New Mexico (United States)
Tengiz Svimonishvili, Univ. of New Mexico (United States)
Petr Georgievich Eliseev, Univ. of New Mexico (United States)
George J. Simonis, Army Research Lab. (United States)


Published in SPIE Proceedings Vol. 3419:
Optoelectronic Materials and Devices
Marek Osinski; Yan-Kuin Su, Editor(s)

© SPIE. Terms of Use
Back to Top