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Proceedings Paper

Strategy for manipulating the optical proximity effect by postexposure bake processing
Author(s): Tsai-Sheng Gau; Chien-Ming Wang; Chang-Ming Dai
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Paper Abstract

It is very easy to manipulate the optical proximity effect (OPE), when the new concept of the post-exposure bake (PEB) processing is suggested. By changing the temperature of the PEB, the bias of the line width between the packed lines and the isolated line varies drastically. The OPE is thus faithfully controllable through the PEB processing. On the other hand, by putting the experimental data in contrast with the theoretical simulation, the OPE is resolved into the resist effect and the optical effect. The resist effect could be eliminated by lowering the PEB temperature, while the optical effect is reduced from choosing a proper stepper illumination setting, NA & (sigma) . Moreover, the linearity and the line-end shortening also get benefits from this new process.

Paper Details

Date Published: 29 June 1998
PDF: 7 pages
Proc. SPIE 3334, Optical Microlithography XI, (29 June 1998); doi: 10.1117/12.310823
Show Author Affiliations
Tsai-Sheng Gau, Industrial Technology Research Institute (Taiwan)
Chien-Ming Wang, Industrial Technology Research Institute (Taiwan)
Chang-Ming Dai, Industrial Technology Research Institute (Taiwan)


Published in SPIE Proceedings Vol. 3334:
Optical Microlithography XI
Luc Van den Hove, Editor(s)

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