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Proceedings Paper

Optimal proximity correction: application for flash memory design
Author(s): Y. O. Chen; D. L. Huang; K. T. Sung; J. J. Chiang; M. Yu; F. Teng; Lung Chu; Juan C. Rey; Douglas A. Bernard; Jiangwei Li; Junling Li; V. Moroz; Victor V. Boksha
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Paper Abstract

Proximity Correction is the technology for which the most of IC manufacturers are committed already. The final intended result of correction is affected by many factors other than the optical characteristics of the mask-stepper system, such as photoresist exposure, post-exposure bake and development parameters, etch selectivity and anisotropy, and underlying topography. The most advanced industry and research groups already reported immediate need to consider wafer topography as one of the major components during a Proximity Correction procedure. In the present work we are discussing the corners rounding effect (which eventually cause electrical leakage) observed for the elements of Poly2 layer for a Flash Memory Design. It was found that the rounding originated by three- dimensional effects due to variation of photoresist thickness resulting from the non-planar substrate. Our major goal was to understand the reasons and correct corner rounding. As a result of this work highly effective layout correction methodology was demonstrated and manufacturable Depth Of Focus was achieved. Another purpose of the work was to demonstrate complete integration flow for a Flash Memory Design based on photolithography; deposition/etch; ion implantation/oxidation/diffusion; and device simulators.

Paper Details

Date Published: 29 June 1998
PDF: 11 pages
Proc. SPIE 3334, Optical Microlithography XI, (29 June 1998); doi: 10.1117/12.310822
Show Author Affiliations
Y. O. Chen, Mosel Vitelic Corp. (United States)
D. L. Huang, Mosel Vitelic Corp. (Taiwan)
K. T. Sung, Mosel Vitelic Corp. (Taiwan)
J. J. Chiang, Mosel Vitelic Corp. (Taiwan)
M. Yu, Mosel Vitelic Corp. (Taiwan)
F. Teng, Mosel Vitelic Corp. (Taiwan)
Lung Chu, Technology Modeling Associates, Inc. (United States)
Juan C. Rey, Technology Modeling Associates, Inc. (United States)
Douglas A. Bernard, Technology Modeling Associates, Inc. (United States)
Jiangwei Li, Technology Modeling Associates, Inc. (United States)
Junling Li, Technology Modeling Associates, Inc. (United States)
V. Moroz, Technology Modeling Associates, Inc. (United States)
Victor V. Boksha, Technology Modeling Associates, Inc. (United States)

Published in SPIE Proceedings Vol. 3334:
Optical Microlithography XI
Luc Van den Hove, Editor(s)

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