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Proceedings Paper

0.25-um logic manufacturability using practical 2D optical proximity correction
Author(s): Michael E. Kling; Kevin D. Lucas; Alfred J. Reich; Bernard J. Roman; Harry Chuang; Percy V. Gilbert; Warren D. Grobman; Edward O. Travis; Paul Tsui; Tam Vuong; Jeff P. West
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Paper Abstract

Simplified 2-D Optical Proximity Correction (OPC) algorithms have been devised, calibrated and implemented on a state-of- the-art 0.25 micrometer random logic process in order to reduce metal line pullback on critical layers. The techniques used are rules-based, but are characterized by fast and robust data conversion algorithms, calibrations based on actual process data improvements in reticle manufacturability, and inspectability of the resultant OPC corrected reticles. Application to local interconnect and metal patterning has corrected fundamental yield-limiting mechanisms in these levels.

Paper Details

Date Published: 29 June 1998
PDF: 11 pages
Proc. SPIE 3334, Optical Microlithography XI, (29 June 1998); doi: 10.1117/12.310749
Show Author Affiliations
Michael E. Kling, Motorola (United States)
Kevin D. Lucas, Motorola (Belgium)
Alfred J. Reich, Motorola (United States)
Bernard J. Roman, Motorola (United States)
Harry Chuang, Motorola (United States)
Percy V. Gilbert, Motorola (United States)
Warren D. Grobman, Motorola (United States)
Edward O. Travis, Motorola (United States)
Paul Tsui, Motorola (United States)
Tam Vuong, Motorola (United States)
Jeff P. West, Motorola (United States)


Published in SPIE Proceedings Vol. 3334:
Optical Microlithography XI
Luc Van den Hove, Editor(s)

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