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Proceedings Paper

Magnetostrictive wire-bonding clamp for semiconductor packaging: initial prototype design, modeling, and experiments
Author(s): David M. Dozor
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Paper Abstract

A magnetostrictive wire-bonding clamp for use in semiconductor packaging applications has been developed by Mechatronic Technology Co. Semiconductor industry trends, requiring high process throughput on increasing lead count packaging, make the magnetostrictive material Terfenol-D a candidate for this application. To construct this small, lightweight device, small samples of Terfenol-D were prepared by ETREMA Products, Inc. This paper reports the initial design, mathematical modeling, and experiments related to this initial prototype.

Paper Details

Date Published: 16 June 1998
PDF: 11 pages
Proc. SPIE 3326, Smart Structures and Materials 1998: Industrial and Commercial Applications of Smart Structures Technologies, (16 June 1998); doi: 10.1117/12.310668
Show Author Affiliations
David M. Dozor, Mechantronic Technology Co. (United States)


Published in SPIE Proceedings Vol. 3326:
Smart Structures and Materials 1998: Industrial and Commercial Applications of Smart Structures Technologies
Janet M. Sater, Editor(s)

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