Share Email Print
cover

Proceedings Paper

Pellicles for x-ray lithography masks
Author(s): Juan R. Maldonado; Steven A. Cordes; Jeffrey A. Leavey; Raul E. Acosta; Fuad Doany; Marie Angelopoulos; C. Waskiewicz
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

The feasibility of using thin films of organic material as a protective cover for x-ray lithography masks has been demonstrated. A pellicle structure that fits unobtrusively inside the mask-wafer gap and on the x-ray lithography NIST standard ring was developed. The pellicle solves several problems: 1) protects the mask absorber from direct contact to external sources of possible damage without itself contacting the absorber, 2) allows effective cleaning of the x-ray mask by preventing dust or debris particles from getting imbedded in the absorber pattern, 3) reduces contamination of the stepper and wafers by absorber metal debris in the event of catastrophic breakage of the mask membrane, 4) reduces contamination of the absorber pattern by debris generated by the resist or the stepper environment during x-ray exposure, and 5) reduces photoelectrons generated by the absorber during x-ray exposure from reaching the resist. Furthermore, pellicles may offer inspection advantages by providing a flat surface without absorber topography. Several approaches for the fabrication of suitable pellicles using organic and inorganic films will be presented in this paper. Pellicles have been successfully tested in the SVGL and SUSS steppers in the IBM Advanced Lithography Facility in the East Fishkill, NY. Results on pellicle's performance together with radiation damage measurements to estimate a pellicle's lifetime are presented in this paper.

Paper Details

Date Published: 5 June 1998
PDF: 10 pages
Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); doi: 10.1117/12.309611
Show Author Affiliations
Juan R. Maldonado, IBM Microelectronics Div. (United States)
Steven A. Cordes, IBM Thomas J. Watson Research Ctr. (United States)
Jeffrey A. Leavey, IBM Microelectronics Div. (United States)
Raul E. Acosta, IBM Thomas J. Watson Research Ctr. (United States)
Fuad Doany, IBM Thomas J. Watson Research Ctr. (United States)
Marie Angelopoulos, IBM Thomas J. Watson Research Ctr. (United States)
C. Waskiewicz, IBM Microelectronics Div. (United States)


Published in SPIE Proceedings Vol. 3331:
Emerging Lithographic Technologies II
Yuli Vladimirsky, Editor(s)

© SPIE. Terms of Use
Back to Top