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Proceedings Paper

Determining photoresist coat sensitivities of 300-mm wafers
Author(s): Robert M. Crowell
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Paper Abstract

This paper presents preliminary data on 300 nm wafer coatings by comparing photoresist coats on 150 nm, 200 mm and 300 mm wafers. Conventional methods of applying photoresist have ben prove effective on wafers with diameters up to 200 nm. How well 150 mm and 200 mm coating processes apply to 300 mm substrates is the focus of this paper. Spin speed versus photoresists thickness curves will be reviewed for all three wafer sizes.Additionally, two major coating uniformity factors, photoresist and cool plate temperature, will be studied for 200 mm and 300 mm wafers.

Paper Details

Date Published: 5 June 1998
PDF: 6 pages
Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); doi: 10.1117/12.309595
Show Author Affiliations
Robert M. Crowell, Tokyo Electron America (United States)

Published in SPIE Proceedings Vol. 3331:
Emerging Lithographic Technologies II
Yuli Vladimirsky, Editor(s)

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