Share Email Print
cover

Proceedings Paper

New family of non-chemically amplified resists
Author(s): Ari Aviram; Marie Angelopoulos; Edward D. Babich; Inna V. Babich; Karen E. Petrillo; David E. Seeger
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Non-chemically amplified resists offer advantages over chemically-amplified (CA) resists because they are less susceptible to temperature variations and contaminants. In order for non-CA resists to be viable, they have to perform lithographically at an equivalent level with the CA resists from the point of view of quantum yield, resolution and etch resistance. We report here on new non-CA resists based on polymer esters that undergo deesterification to the corresponding acids upon exposure to UV, x-ray and e-beam radiation. The efficiency of the radiation reaction is surprisingly high. The resulting poly acids are base soluble and can be employed as positive working resists. The resists are composed of polymers and copolymers of methacrylate esters. The sensitivity of one derivative to x-ray is 75 mJ/cm2 and to e-beam is 1.0 (mu) C/cm2 at 10 KV. Best resolution obtained was 125 nm with x-ray radiation.

Paper Details

Date Published: 5 June 1998
PDF: 10 pages
Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); doi: 10.1117/12.309589
Show Author Affiliations
Ari Aviram, IBM Thomas J. Watson Research Ctr. (United States)
Marie Angelopoulos, IBM Thomas J. Watson Research Ctr. (United States)
Edward D. Babich, IBM Thomas J. Watson Research Ctr. (United States)
Inna V. Babich, IBM Thomas J. Watson Research Ctr. (United States)
Karen E. Petrillo, IBM Thomas J. Watson Research Ctr. (United States)
David E. Seeger, IBM Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 3331:
Emerging Lithographic Technologies II
Yuli Vladimirsky, Editor(s)

© SPIE. Terms of Use
Back to Top