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Proceedings Paper

Large-area high-throughput high-resolution lithography systems for flat-panel displays and microelectronic modules
Author(s): Kanti Jain; Thomas J. Dunn; Nestor Farmiga; Mark Zemel; Carl Weisbecker
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Paper Abstract

We have developed a novel class of projection lithography system that provide both high-throughput resist patterning and dielectric via formation for production of a variety of electronic modules, including flat-panel displays, multichip modules, printed circuit boards, and microelectromechanical systems. The new technology eliminates limitations of current lithography tools, including contact and proximity tools, conventional projection systems, steppers and scanners, and direct-write machines. Further, the new system concept is highly modular, thereby providing equipment upgradability as well as choice of user-specified system configurations. These results are achieved with a novel, hexagonal seamless scanning concept and a single-planar stage system configuration that provide both high optical and scanning efficiencies, and combine high-resolution imaging with very large exposure area capability. We describe the new technology and present experimental results. These lithography systems are highly attractive for cost-effective production of microelectronic products with feature sizes ranging from 15 micrometers to below 1 micrometers and substrate sizes ranging from 150 X 150 mm to larger than 610 X 660 mm.

Paper Details

Date Published: 5 June 1998
PDF: 10 pages
Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); doi: 10.1117/12.309573
Show Author Affiliations
Kanti Jain, Anvik Corp. (United States)
Thomas J. Dunn, Anvik Corp. (United States)
Nestor Farmiga, Anvik Corp. (United States)
Mark Zemel, Anvik Corp. (United States)
Carl Weisbecker, Anvik Corp. (United States)

Published in SPIE Proceedings Vol. 3331:
Emerging Lithographic Technologies II
Yuli Vladimirsky, Editor(s)

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