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Proceedings Paper

Mask and wafer inspection and cleaning for proximity x-ray lithography
Author(s): Jeffrey A. Leavey; Pawitter J. S. Mangat
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Paper Abstract

Over the past five years that eh IBM Advanced Lithography Facility (ALF) has been operational, we have learned much about the practical aspects of proximity x-ray lithography: synchrotron reliability; mask manufacturing; process development; and mask and wafer handling, inspection, and cleaning. Because proximity x-ray printing requires small mask-to-wafer gaps, the primary concern is protecting the mask from large foreign material (FM). Particle heights greater than the gap represent a mask scratch or breakage risk that must be managed. ALF, the IBM Advanced Mask Facility (AMF), and the Proximity x-ray Lithography Association have developed techniques for inspection and cleaning of masks and wafers to address both large and small FM concerns. This paper will review the practical implementation of inspection and cleaning techniques as presently used in ALF and AMF.

Paper Details

Date Published: 5 June 1998
PDF: 10 pages
Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); doi: 10.1117/12.309571
Show Author Affiliations
Jeffrey A. Leavey, IBM Microelectronics Div. (United States)
Pawitter J. S. Mangat, Motorola (United States)

Published in SPIE Proceedings Vol. 3331:
Emerging Lithographic Technologies II
Yuli Vladimirsky, Editor(s)

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