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Proceedings Paper

Analysis and identification of factors contributing to the overlay budget
Author(s): Klaus Simon; R. Macklin; Robert A. Selzer; Olga Vladimirsky; Yuli Vladimirsky; Franco Cerrina
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Paper Abstract

The most important contributions to overlay inaccuracy are coming from well-known sources like mask pattern placement accuracy, alignment system accuracy and stage performance of the exposure tools. As the allowances for overlay budget decrease, and improvements in mask fabrication and stage performance are made, a number of previously less significant contributions, such as resolution, optical interference, and focusing accuracy of alignment system, as well as from wafer processing, have to be considered. These contributions are characterized in detail in this paper. The investigation was focused on a proven optical alignment system and overlay contribution as they apply to x-ray and optical lithography. Special emphasis was made on contributions form wafer processing.

Paper Details

Date Published: 5 June 1998
PDF: 8 pages
Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); doi: 10.1117/12.309567
Show Author Affiliations
Klaus Simon, Suss Advanced Lithography, Inc. (Netherlands)
R. Macklin, Suss Advanced Lithography, Inc. (United States)
Robert A. Selzer, Suss Advanced Lithography, Inc. (United States)
Olga Vladimirsky, Ctr. for X-ray Lithography/Univ. of Wisconsin/Madison (United States)
Yuli Vladimirsky, Ctr. for X-ray Lithography/Univ. of Wisconsin/Madison (United States)
Franco Cerrina, Ctr. for X-ray Lithography/Univ. of Wisconsin/Madison (United States)


Published in SPIE Proceedings Vol. 3331:
Emerging Lithographic Technologies II
Yuli Vladimirsky, Editor(s)

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