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Proceedings Paper

X ray fills the gap
Author(s): Chet Wasik; G. P. Murphy; Alek C. Chen; Azalia A. Krasnoperova; Alex L. Flamholz; Daniel J. DeMay; Jeffrey A. Leavey; Steve Loh; Sue Chaloux; Alan C. Thomas; Sang Lee; Kenneth J. Giewont; Paul D. Agnello
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Paper Abstract

X-ray lithography has been used in mix and match mode with optical steppers to build test circuits in support of DRAM and Logic development at IBM's Advanced Semiconductor Technology Center, ASTC. Prior to building the test devices, hundreds of wafers were exposed using x-ray lithography to define the etch processes for critical levels and to help separate optical lithography, resist and etching effects. The demand for this type of support required IBM's Advanced Lithography Facility (ALF) to focus on a set of pilot line issues not previously faced by this emerging lithography. The challenges and solutions which resulted are discussed. This paper examines the requirements for the introduction of x-ray into pilot line use based on ALF's most recent experience and performance.

Paper Details

Date Published: 5 June 1998
PDF: 7 pages
Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); doi: 10.1117/12.309566
Show Author Affiliations
Chet Wasik, Lockheed Martin Federal Systems and IBM Microelectronics Div. (United States)
G. P. Murphy, Lockheed Martin Federal Systems and IBM Microelectronics Div. (United States)
Alek C. Chen, Lockheed Martin Federal Systems and IBM Microelectronics Div. (Taiwan)
Azalia A. Krasnoperova, Lockheed Martin Federal Systems and IBM Microelectronics Div. (United States)
Alex L. Flamholz, Lockheed Martin Federal Systems and IBM Microelectronics Div. (United States)
Daniel J. DeMay, Lockheed Martin Federal Systems and IBM Microelectronics Div. (United States)
Jeffrey A. Leavey, IBM Microelectronics Div. (United States)
Steve Loh, IBM Microelectronics Div. (United States)
Sue Chaloux, IBM Microelectronics Div. (United States)
Alan C. Thomas, IBM Microelectronics Div. (United States)
Sang Lee, IBM Microelectronics Div. (United States)
Kenneth J. Giewont, IBM Microelectronics Div. (United States)
Paul D. Agnello, IBM Microelectronics Div. (United States)


Published in SPIE Proceedings Vol. 3331:
Emerging Lithographic Technologies II
Yuli Vladimirsky, Editor(s)

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