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Proceedings Paper

Applications of sealed CO2 lasers for the microelectronics industry
Author(s): Sri Venkat
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Paper Abstract

The advent of sealed CO2 lasers has significantly increased industrial laser applications during the last 5 years. The main advantages of this type of laser are the compact footprint, robust all-metal construction, no maintenance and low operating costs. The applications of sealed CO2 lasers in the microelectronics industry can be broadly classified into four major categories: Ceramic Processing for Thick/Thin Films, Printed Circuit Boards and Flex Circuit Board Drilling and Routing, Solder Mask Cutting for SMT and Microwelding for the packaging industry. This paper summarizes potential applications for sealed CO2 lasers in the microelectronics industry. Detailed process capability with speeds and thicknesses will be presented and comparisons will be made to other laser and conventional fabrication techniques.

Paper Details

Date Published: 3 June 1998
PDF: 9 pages
Proc. SPIE 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III, (3 June 1998); doi: 10.1117/12.309511
Show Author Affiliations
Sri Venkat, Convergent Energy Inc. (United States)


Published in SPIE Proceedings Vol. 3274:
Laser Applications in Microelectronic and Optoelectronic Manufacturing III
Jan J. Dubowski; Peter E. Dyer, Editor(s)

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