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Proceedings Paper

Precise microfabrication of wide-bandgap materials by VUV-UV multiwavelength ablation
Author(s): Koji Sugioka; Jie Zhang; Satoshi Wada; Hideo Tashiro; Katsumi Midorikawa; Koichi Toyoda
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Paper Abstract

Novel ablation of wide band gap materials such as fused quartz by multiwavelength excitation using a VUV-UV laser system is reviewed. Simultaneous irradiation of VUV and UV laser beams emitted from a VUV Raman laser presents great potential for precise microfabrication of the materials. The mechanism and the role of VUV beams in this process are made clear on the basis of band structure. Furthermore, the advantages of this technique are discussed in comparison with the conventional single wavelength ablation. This technique is applied to selected area removal of SiO2 films on Al lines for repair of Si integrated circuits.

Paper Details

Date Published: 3 June 1998
PDF: 9 pages
Proc. SPIE 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III, (3 June 1998); doi: 10.1117/12.309493
Show Author Affiliations
Koji Sugioka, RIKEN-Institute of Physical and Chemical Research (Japan)
Jie Zhang, RIKEN-Institute of Physical and Chemical Research (Japan)
Satoshi Wada, RIKEN-Institute of Physical and Chemical Research (Japan)
Hideo Tashiro, RIKEN-Institute of Physical and Chemical Research (Japan)
Katsumi Midorikawa, RIKEN-Institute of Physical and Chemical Research (Japan)
Koichi Toyoda, Science Univ. of Tokyo (Japan)


Published in SPIE Proceedings Vol. 3274:
Laser Applications in Microelectronic and Optoelectronic Manufacturing III
Jan J. Dubowski; Peter E. Dyer, Editor(s)

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