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Proceedings Paper

Architecture and optical system design for translucent smart pixel array (TRANSPAR) chips
Author(s): C.-H. Chen; Bogdan Hoanca; C. B. Kuznia; Alexander A. Sawchuk; J.-M. Wu
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Paper Abstract

We present the architecture and optical design for a smart pixel optoelectronic system that performs very high throughput networking and three-dimensional single-instruction multiple-data (SIMD) parallel signal processing. The smart pixel chip in the system is called a TRANslucent Smart Pixel Array (TRANSPAR), and it contains a 2-D array of fine-grain processing elements with additional functionality for performing carrier-sense multiple access with collision detection (CSMAJCD) networking. This chip is currently being fabricated by Lucent through the DARPA/GMU/CO-OP foundry program in 0.5 micron CMOS with flip-chip bonded multiple quantum well (MQW) optical modulators and detectors (II.

Paper Details

Date Published: 22 May 1998
PDF: 4 pages
Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); doi: 10.1117/12.308952
Show Author Affiliations
C.-H. Chen, Univ. of Southern California (United States)
Bogdan Hoanca, Univ. of Southern California (United States)
C. B. Kuznia, Univ. of Southern California (United States)
Alexander A. Sawchuk, Univ. of Southern California (United States)
J.-M. Wu, Univ. of Southern California (United States)


Published in SPIE Proceedings Vol. 3490:
Optics in Computing '98
Pierre H. Chavel; David A. B. Miller; Hugo Thienpont, Editor(s)

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