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Proceedings Paper

CMOS-compatible free-space optical interconnects
Author(s): Christine T. Mollenkopf; John M. Hessenbruch; Jongwoo Kim; Richard V. Stone; Peter S. Guilfoyle
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Paper Abstract

Photonic smart pixel arrays are being developed for use in high density input/output applications. Arrays containing 1024 smart pixels are integrated on a single chip which occupies 1.6 cm X 1.6 cm of area. A smart pixel cell is made up of a vertical cavity surface emitting laser (VCSEL), a detector, an analog receiver, a laser driver, and digital logic circuitry. Additional circuitry can be embedded in the smart pixel cell to provide increased functionality, such as digital logic operations and memory functions. A diffractive optical interconnect element can be added to the smart pixel array for optimization of a free space optical interconnect system. The oxide-confined GaAs/AlGaAs VCSELs and the GaAs/AlGaAs detectors will be flip-chip bonded to the surface of the CMOS substrate. The surface of the CMOS substrate will be processed after circuit fabrication in preparation for flip-chip bonding. This processing will make the pads of the CMOS compatible with the contacts of the VCSEL and detector surfaces. The integrated smart pixel combines low power consumption and high speed operation in an optoelectronic module for the use in high speed optical interconnects.

Paper Details

Date Published: 22 May 1998
PDF: 4 pages
Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); doi: 10.1117/12.308877
Show Author Affiliations
Christine T. Mollenkopf, OptiComp Corp. (United States)
John M. Hessenbruch, OptiComp Corp. (United States)
Jongwoo Kim, OptiComp Corp. (United States)
Richard V. Stone, OptiComp Corp. (United States)
Peter S. Guilfoyle, OptiComp Corp. (United States)


Published in SPIE Proceedings Vol. 3490:
Optics in Computing '98
Pierre H. Chavel; David A. B. Miller; Hugo Thienpont, Editor(s)

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