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Proceedings Paper

Optomechanical, electrical, and thermal packaging of large 2D optoelectronic device arrays for free-space optical interconnects
Author(s): Michael H. Ayliffe; D. Kabal; P. Khurana; Frederic K. Lacroix; Andrew G. Kirk; Frank A. P. Tooley; David V. Plant
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Paper Details

Date Published: 22 May 1998
PDF: 4 pages
Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); doi: 10.1117/12.308862
Show Author Affiliations
Michael H. Ayliffe, McGill Univ. (Canada)
D. Kabal, McGill Univ. (Canada)
P. Khurana, McGill Univ. (Canada)
Frederic K. Lacroix, McGill Univ. (Canada)
Andrew G. Kirk, McGill Univ. (Canada)
Frank A. P. Tooley, McGill Univ. (Canada)
David V. Plant, McGill Univ. (Canada)


Published in SPIE Proceedings Vol. 3490:
Optics in Computing '98
Pierre H. Chavel; David A. B. Miller; Hugo Thienpont, Editor(s)

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