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Proceedings Paper

Comparison of techniques for bonding VCSELs directly to ICs
Author(s): Rui Pu; Eric M. Hayes; Carl W. Wilmsen; Kent D. Choquette; Hong Q. Hou; Kent M. Geib
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Paper Abstract

The fabrication technologies and bonding characteristics of three VCSEL bonding techniques are compared in order to determine the more reliable and robust.

Paper Details

Date Published: 22 May 1998
PDF: 4 pages
Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); doi: 10.1117/12.308861
Show Author Affiliations
Rui Pu, Colorado State Univ. (United States)
Eric M. Hayes, Colorado State Univ. (United States)
Carl W. Wilmsen, Colorado State Univ. (United States)
Kent D. Choquette, Sandia National Labs. (United States)
Hong Q. Hou, Sandia National Labs. (United States)
Kent M. Geib, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 3490:
Optics in Computing '98
Pierre H. Chavel; David A. B. Miller; Hugo Thienpont, Editor(s)

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