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Proceedings Paper

Sampling requirements for the analysis of misregistration
Author(s): Ramkumar Subramanian; William D. Heavlin; Eileen M. Coons; Bharath Rangarajan
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Paper Abstract

With the adoption of increasingly tight design rules (less than 100 nm) for overlay, it is critical that the sample used to quantify wafer misregistration be as representative as possible. In this paper, we look at misregistration after two layers, both chosen as most critical to overlay design rules for a logic technology process. Several wafers at each layer were patterned, after which they were mapped on a KLA overlay tool. The mapping was done on all sites with 5 measurement points on each site in an X pattern. The wafers also had been subject to chemical-mechanical polish and its associated mechanical stresses. We identify representative extreme sites using a statistical technique called archetypal analysis. We describe how many sample points are required to adequately describe the distribution of overlay across a wafer.

Paper Details

Date Published: 8 June 1998
PDF: 10 pages
Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); doi: 10.1117/12.308781
Show Author Affiliations
Ramkumar Subramanian, Advanced Micro Devices, Inc. (United States)
William D. Heavlin, Advanced Micro Devices, Inc. (United States)
Eileen M. Coons, Advanced Micro Devices, Inc. (United States)
Bharath Rangarajan, Advanced Micro Devices, Inc. (United States)


Published in SPIE Proceedings Vol. 3332:
Metrology, Inspection, and Process Control for Microlithography XII
Bhanwar Singh, Editor(s)

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