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Proceedings Paper

Photoresist focus exposure matrix (FEM) measurements using critical-dimension atomic force microscopy (CD AFM)
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Paper Abstract

Focus exposure matrices (FEMs) are a critical tool for evaluating the performance of lithographic processes. Any change in any process component, including critical dimension (CD) targets, chemistry, optics, or processing times requires that an FEM be run to verify process performance. Scheduled FEMs are also used as part of regular process monitoring. The CD-AFM is a powerful tool in evaluating FEMs. Unlike standard AFMs it quantitatively profiles lines and trenches in three dimensions. Further, none of the tedious and time consuming sample preparation required by cross-sectional TEM or SEM is needed; since samples need not be cleaved, profiles can conveniently be measured anywhere on the wafer and in any order. A CD-FEM is used to characterize an FEM wafer and the results are compared with those obtained with electron microscopy. First, the CD-AFM is calibrated, which includes the characterization of the tip geometry. Then, the measurements on the FEM wafer is made and the results computed taking the tip width into account. The measurements thus obtained are compared with SEM measurements.

Paper Details

Date Published: 8 June 1998
PDF: 11 pages
Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); doi: 10.1117/12.308777
Show Author Affiliations
A. Meyyappan, Veeco Instruments, Inc. (United States)
Sylvain Muckenhirn, Veeco Process Metrology (United States)

Published in SPIE Proceedings Vol. 3332:
Metrology, Inspection, and Process Control for Microlithography XII
Bhanwar Singh, Editor(s)

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