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Proceedings Paper

New particle-inspection system for CMP-planarization-processed metal layers
Author(s): Masami Ikota; Aritoshi Sugimoto; Yuko Inoue; Junichi Taguchi; Tetsuya Watanabe
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Paper Abstract

With the application of chemical mechanical polishing (CMP), particles become the main defect mode among the various modes of defects. Therefore, particle control becomes increasingly important. For the effective particle control, we need to control not only the number of defects but also the size of defects. However, a conventional particle inspection system using laser scattering could not obtain the information of the accurate particle size. We have developed the new system which can obtain the information of accurate particle size by using image processing. The particle size measured by the new system well agrees with the size measured by SEM. With the new system, we can operate the killer particle control effectively.

Paper Details

Date Published: 8 June 1998
PDF: 10 pages
Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); doi: 10.1117/12.308742
Show Author Affiliations
Masami Ikota, Hitachi, Ltd. (Japan)
Aritoshi Sugimoto, Hitachi, Ltd. (Japan)
Yuko Inoue, Hitachi Electronics Engineering, Ltd. (Japan)
Junichi Taguchi, Hitachi Electronics Engineering, Ltd. (Japan)
Tetsuya Watanabe, Hitachi Electronics Engineering, Ltd. (Japan)

Published in SPIE Proceedings Vol. 3332:
Metrology, Inspection, and Process Control for Microlithography XII
Bhanwar Singh, Editor(s)

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