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Proceedings Paper

Realization of holographic optical interconnects for a multichip module on silicon
Author(s): Hans-Ulrich Grubert
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Paper Abstract

The design, assembly and packaging of a multichip module on silicon with a holographic-optical 1 to 4 interconnect is presented. The potential of the system containing commercially available components is demonstrated. Holographic optical elements in dichromated gelatine as well as computer-generated holograms are used to distribute and focus a clock signal generated by a vertical-cavity surface-emitting laser diode onto silicon photodiodes. The two different kinds of holograms are compared with respect to their efficiency, fabrication effort and compatibility with the demands of a microelectronic system. Alignment issues, thermal behavior and the total optical link efficiency are discussed.

Paper Details

Date Published: 5 May 1998
PDF: 8 pages
Proc. SPIE 3288, Optoelectronic Interconnects V, (5 May 1998); doi: 10.1117/12.307583
Show Author Affiliations
Hans-Ulrich Grubert, SICAN GmbH (Germany)

Published in SPIE Proceedings Vol. 3288:
Optoelectronic Interconnects V
Ray T. Chen; Julian P. G. Bristow, Editor(s)

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