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Proceedings Paper

Processing of free-space optical interconnect devices using solder engineering
Author(s): Athanasios Dimoulas; Nickolaos E. Strifas; Robert H. Esser; Aristos Christou; Richard V. Stone; Christine T. Travers; Peter S. Guilfoyle; John M. Hessenbruch
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Paper Abstract

A packaging technology for global (N4) free space optical interconnects has been developed and implemented by means of hybrid integration using solder engineering. Solder arrays, defined by photolithography and electrodeposition, are used to physically attach, optically align and electrically connect the microoptical components. A processing sequence has been fully developed for the fabrication of the emitter sub-assembly consist of 8 X 8 and 16 X 16 arrays of vertical cavity surface emitting lasers and diffractive optical interconnect elements. The first level of integration consisting of the metal signal lines, ground plane and solder arrays has been completed with excellent uniformity and yield of the deposited solder.

Paper Details

Date Published: 5 May 1998
PDF: 7 pages
Proc. SPIE 3288, Optoelectronic Interconnects V, (5 May 1998); doi: 10.1117/12.307581
Show Author Affiliations
Athanasios Dimoulas, Univ. of Maryland/College Park (United States)
Nickolaos E. Strifas, Univ. of Maryland/College Park (United States)
Robert H. Esser, Univ. of Maryland/College Park (United States)
Aristos Christou, Univ. of Maryland/College Park (United States)
Richard V. Stone, OptiComp Corp. (United States)
Christine T. Travers, OptiComp Corp. (United States)
Peter S. Guilfoyle, OptiComp Corp. (United States)
John M. Hessenbruch, OptiComp Corp. (United States)

Published in SPIE Proceedings Vol. 3288:
Optoelectronic Interconnects V
Ray T. Chen; Julian P. G. Bristow, Editor(s)

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