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Proceedings Paper

Board-level clock distribution using laminated end-tapered fiber bundles
Author(s): Yao Li; Jan Popelek; Ting Wang; June-Koo Rhee; Lijun J. Wang
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Paper Abstract

Embedding of end-tapered, thin-cladding fiber bundles for board- level large bandwidth optical clock distribution is proposed and implemented. Fan-outs of 1 to 64- and 128-nodes on a printed circuit board of area 13 X 9 cm2 are experimentally demonstrated. Dispersion measurement shows a 30 picosecond pulse broadening over 30 cm length of the fiber, thereby indicating multi Gb/s clock delivery capability. Power coupling efficiency of 3 dB with coupling nonuniformity of 4.7 - 5.5 dB is observed.

Paper Details

Date Published: 5 May 1998
PDF: 4 pages
Proc. SPIE 3288, Optoelectronic Interconnects V, (5 May 1998); doi: 10.1117/12.307564
Show Author Affiliations
Yao Li, NEC Research Institute (United States)
Jan Popelek, NEC Research Institute (United States)
Ting Wang, NEC Research Institute (United States)
June-Koo Rhee, NEC Research Institute (United States)
Lijun J. Wang, NEC Research Institute (United States)

Published in SPIE Proceedings Vol. 3288:
Optoelectronic Interconnects V
Ray T. Chen; Julian P. G. Bristow, Editor(s)

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