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Proceedings Paper

Guided-wave optoelectronic clock-distribution networks on multichip modules using MEMS fabrication techniques
Author(s): Seungug Koh; Sung-Dong Suh; Danjin Wu; Mark Lantz
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Paper Abstract

This paper addresses the design, fabrication, and packaging issues of optoelectronic clock distribution networks on multichip modules (MCM) by combining guided-wave optoelectronic interconnect, MCM packaging, and microelectromechanical system fabrication techniques. The proposed prototype employs the silica glass waveguide networks on silicon substrates and innovative I/O coupling method which utilizes the micromachined through-holes across MCM substrates and silicon mirror arrays. Microstructures for I/O coupling have been fabricated using KOH etchants at various processing conditions and the silica glass optical waveguide networks are fabricated using FHD and RIE processes. The four fanout optoelectronic clock distribution networks are prototyped and characterized by measuring the overall insertion losses and the power equalities at the fanout nodes.

Paper Details

Date Published: 5 May 1998
PDF: 6 pages
Proc. SPIE 3288, Optoelectronic Interconnects V, (5 May 1998); doi: 10.1117/12.307563
Show Author Affiliations
Seungug Koh, Univ. of Dayton (United States)
Sung-Dong Suh, Univ. of Dayton (United States)
Danjin Wu, ITI (United States)
Mark Lantz, U.S. Department of Defense (United States)

Published in SPIE Proceedings Vol. 3288:
Optoelectronic Interconnects V
Ray T. Chen; Julian P. G. Bristow, Editor(s)

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