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Proceedings Paper

Composite resin bond strength to tooth structure treated with an erbium,chromium:YSGG-laser-powered hydrokinetic system
Author(s): Sean Lin; Angelo A. Caputo; Ioana-Mihaela Rizoiu; Lewis R. Eversole
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Paper Abstract

Er;YAG and Er,Cr;YSGG Lasers that emit in the near red wave lengths cut both enamel and dentine. Dental preparations are often restored with composite resins that bond to enamel. The purpose of this investigation was to assess the shear strength of composite resin bonded to tooth structure cut by an Er,Cr;YSGG powered hydrokinetic system (HKS), (Millennium SystemTM, BioLase Technology, Inc, San Clemente, CA) as compared to surfaces cut with a carbide bur. Extracted human molars devoid of caries and restorations were treated with both systems, with and without acid etching. Shear bond strengths (SBS) for composite resin adherence to these surfaces were measured and compared. There was no significant difference between bur and HKS prepared surfaces in the etched enamel group. The SBS for composite bonded to nonetched enamel was significantly higher with the HKS treatment compared with the bur cut surfaces. There were no significant differences between acid etched bur cut and non etched HKS enamel surfaces. Bonded to nonetched dentin was found to be higher for bur cut surfaces. It is concluded that the Er,Cr;YSGG hydrokinetic system produces surface characteristics that allow for adequate bonding of composite resin to both etched and nonetched enamel.

Paper Details

Date Published: 22 April 1998
PDF: 9 pages
Proc. SPIE 3248, Lasers in Dentistry IV, (22 April 1998); doi: 10.1117/12.306026
Show Author Affiliations
Sean Lin, Univ. of California/Los Angeles School of Demtistry (United States)
Angelo A. Caputo, Univ. of California/Los Angeles School of Dentistry (United States)
Ioana-Mihaela Rizoiu, BioLase Technology, Inc. (United States)
Lewis R. Eversole, Univ. of California/Los Angeles School of Dentistry (United States)


Published in SPIE Proceedings Vol. 3248:
Lasers in Dentistry IV
John D. B. Featherstone; Peter Rechmann; Daniel Fried, Editor(s)

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