Share Email Print
cover

Proceedings Paper

MEMS for measuring deflection, acceleration, and ice sensing on rotorcraft
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Smart MEMS (MicroElectroMechanical Systems) in the form of integrated sensors and actuators offer significant potential for many rotorcraft applications. Sensing of flex beam deflection and acceleration, ice formation and deicing are major candidate areas where smart conformal MEMS based sensors can be exploited by the rotorcraft community. The major technical barrier of the present day smart structures technology is the need for wired communication between sensors and actuators in the rotating system and controllers, data storage units, and cockpit avionics. Many proposed sensors and actuators are commonly distributed either along the blade length or, in the active flap devices, out near the 75% blade radial station. Also they are not conformal to the airfoil shape of the rotor blades. The communication between rotating and fixed systems is typically accomplished using complex slip ring assemblies transferring electronic information down through the rotor shaft. Although advances have been made in wired communication, these complex assemblies are essentially similar to test hardware and present numerous reliability and maintainability limitations when implemented on a production scale. Considering these limitations, development of a wireless means of communication through a new generation of conformal sensors with built-in antenna, akin to telemetry, could have a dramatic beneficial payoff for rotorcraft applications. In this paper, an integration of IDT (inter digital transducer) microsensors and MEMS sensors is presented.

Paper Details

Date Published: 16 April 1998
PDF: 12 pages
Proc. SPIE 3321, 1996 Symposium on Smart Materials, Structures, and MEMS, (16 April 1998); doi: 10.1117/12.305612
Show Author Affiliations
Vijay K. Varadan, The Pennsylvania State Univ. (United States)
Vasundara V. Varadan, The Pennsylvania State Univ. (United States)


Published in SPIE Proceedings Vol. 3321:
1996 Symposium on Smart Materials, Structures, and MEMS
Vasu K. Aatre; Vijay K. Varadan; Vasundara V. Varadan, Editor(s)

© SPIE. Terms of Use
Back to Top