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Proceedings Paper

Application of anisotropic conductive films for realization of interconnects in micromechanical structures
Author(s): In-Byeong Kang; Malcolm R. Haskard; Noel D. Samaan
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Paper Abstract

A new micromachining process, the application of an anisotropic conductive film (ACF) for micromechanical structures as well as interconnection both mechanically and electrically, is reported. The film acts as a spacer and adhesive as well as an electrical conductor in the vertical direction. The process provides very flexible design scheme and simple fabrication process. New micropump structure was proposed, and simple microstructures have been fabricated and tested successfully. The full details of experiment are reported, experiments where ACF type CP 7621 (Sony Chemical Co) was used to bond p type (100) silicon wafers.

Paper Details

Date Published: 16 April 1998
PDF: 6 pages
Proc. SPIE 3321, 1996 Symposium on Smart Materials, Structures, and MEMS, (16 April 1998); doi: 10.1117/12.305553
Show Author Affiliations
In-Byeong Kang, Univ. of South Australia (Australia)
Malcolm R. Haskard, Univ. of South Australia (Australia)
Noel D. Samaan, Univ. of South Australia (Australia)

Published in SPIE Proceedings Vol. 3321:
1996 Symposium on Smart Materials, Structures, and MEMS
Vasu K. Aatre; Vijay K. Varadan; Vasundara V. Varadan, Editor(s)

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