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Proceedings Paper

Thin film Au-Sn bonding for optoelectronic integration
Author(s): John J. Callahan; Timothy J. Drabik; Kevin P. Martin; Chi Fan
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Paper Abstract

Eutectic bonding employing vacuum-deposited Au and Sn precursor layers, and based on a novel process, can effect quasi-monolithic hybridization of thin-film III-V devices with silicon substrates.

Paper Details

Date Published: 20 April 1998
PDF: 6 pages
Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); doi: 10.1117/12.305490
Show Author Affiliations
John J. Callahan, Georgia Institute of Technology (United States)
Timothy J. Drabik, Georgia Institute of Technology (United States)
Kevin P. Martin, Georgia Institute of Technology (United States)
Chi Fan, Univ. of California/San Diego (United States)


Published in SPIE Proceedings Vol. 3289:
Micro-Optics Integration and Assemblies
Michael R. Feldman; Yung-Cheng Lee, Editor(s)

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