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Proceedings Paper

Modeling for solder self-assembled MEMS
Author(s): Kevin F. Harsh; Yung-Cheng Lee
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Paper Abstract

A new method of assembling MEMS is being developed that uses solder surface tension force to manipulate and assemble MEMS 3D structures. Modeling is critical to design solder joints for precision assembly. An accurate model has been developed based on the principle of surface energy minimization. Using surface evolver software, this model considers 3D MEMS configurations with different pad dimensions, geometries, and volumes of the solder joint. The software calculates solder shapes with local minimum surface energies and identifies the final shape with the global minimum energy. A two-plate popped-up MEMS structure was modeled and experimentally measured. The experiment confirmed the model could predict the final, equilibrium angle to within +/- 2 degrees. This accuracy level is actually limited by the experimental error bar of +/- 2 degrees, which was caused by the volume variation of the solder spheres used. The model's accuracy is expected to be much better. Nevertheless, the present model, with the verified accuracy, can help MEMS researchers design innovative 3D MEMS assembled using solder.

Paper Details

Date Published: 20 April 1998
PDF: 8 pages
Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); doi: 10.1117/12.305485
Show Author Affiliations
Kevin F. Harsh, Univ. of Colorado/Boulder (United States)
Yung-Cheng Lee, Univ. of Colorado/Boulder (United States)


Published in SPIE Proceedings Vol. 3289:
Micro-Optics Integration and Assemblies
Michael R. Feldman; Yung-Cheng Lee, Editor(s)

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