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Proceedings Paper

Dielectric microfilter arrays for local resolving color sensors
Author(s): Marcus Frank; Uwe B. Schallenberg; Norbert Kaiser; Wolfgang Buss
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Paper Abstract

Two different types of color sensor have been developed, which are adaptable to a wide variety of industrial applications. One kind of sensor was developed by depositing dielectric interference filters directly on photoelectric cells, applying a low temperature coating procedure. This way it was possible to accommodate spectral characteristics to the specific spectral sensitivity of the photoelectric cells, minimizing losses by absorption and scattered light in the desired spectral region. The geometric shape of these coated cells is suitable especially for color measurements using fibers. The second kind of color sensors, consisting of miniaturized photoelectric cell arrays and three different micro-patterned interference filter arrays, arranged on a glass substrate, make it possible to distinguish and measure colors with a local resolution. The honey-comb-arrangement of filter- and receiver cells and a flexible setup also permits a fast adaptation to different applications. In this paper design and development of both miniaturized interference filers are described. The different manufacturing procedures are depicted, advantages and questions arising with the employment of interference filters are discussed and the entire assembly of both sensors is presented.

Paper Details

Date Published: 20 April 1998
PDF: 8 pages
Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); doi: 10.1117/12.305484
Show Author Affiliations
Marcus Frank, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Uwe B. Schallenberg, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Norbert Kaiser, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)
Wolfgang Buss, Fraunhofer-Institut fuer Angewandte Optik und Feinmechanik (Germany)

Published in SPIE Proceedings Vol. 3289:
Micro-Optics Integration and Assemblies
Michael R. Feldman; Yung-Cheng Lee, Editor(s)

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