Share Email Print

Proceedings Paper

Techniques and applications for integrating a semiconductor laser on a micromachined die
Author(s): Joseph G. Bouchard; Victor M. Bright; David M. Burns
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This paper describes methods for attaching a vertical cavity surface emitting laser (VCSEL) on to a surface micromachined die. Techniques investigated include silver paste, soldering, wire bonding, and gold pads with integrated resistive heaters. Each technique is evaluated based on reliability, positioning tolerances, and secondary effects. Applications include single chip laser beam scanning.

Paper Details

Date Published: 20 April 1998
PDF: 8 pages
Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); doi: 10.1117/12.305480
Show Author Affiliations
Joseph G. Bouchard, Air Force Insitute of Technology (United States)
Victor M. Bright, Univ. of Colorado/Boulder (United States)
David M. Burns, Air Force Institute of Technology (United States)

Published in SPIE Proceedings Vol. 3289:
Micro-Optics Integration and Assemblies
Michael R. Feldman; Yung-Cheng Lee, Editor(s)

© SPIE. Terms of Use
Back to Top