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Proceedings Paper

Couple: an integrated model for optical interconnect modules
Author(s): R. Brian Hooker; Nuri Delen; Adam S. Fedor; Matthew V. Ball; J. S. Wu; Saeed Hareb; T. H. Ju; Y. C. Lee; Charles W. Stirk
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Paper Abstract

We have developed a modeling tool that integrates optical, cost, thermal, mechanical, and solder models under a common user interface. The models are connected together to allow trade-off studies between parameters existing within different models. We have applied the integrated models to a family of optical interconnect modules. In this paper we will show how the integrated models can help the users design, as well as understand tradeoffs, in optical modules.

Paper Details

Date Published: 20 April 1998
PDF: 14 pages
Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); doi: 10.1117/12.305472
Show Author Affiliations
R. Brian Hooker, Univ. of Colorado/Boulder (United States)
Nuri Delen, Univ. of Colorado/Boulder (United States)
Adam S. Fedor, Univ. of Colorado/Boulder (United States)
Matthew V. Ball, Univ. of Colorado/Boulder (United States)
J. S. Wu, Univ. of Colorado/Boulder (United States)
Saeed Hareb, Univ. of Colorado/Boulder (United States)
T. H. Ju, Univ. of Colorado/Boulder (United States)
Y. C. Lee, Univ. of Colorado/Boulder (United States)
Charles W. Stirk, Bosonics Inc. (United States)


Published in SPIE Proceedings Vol. 3289:
Micro-Optics Integration and Assemblies
Michael R. Feldman; Yung-Cheng Lee, Editor(s)

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