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Proceedings Paper

Experimental study on mechanical, thermomechanical, and optomechanical behaviors of holographic materials
Author(s): Sean X. Wu; Ching-Shan Cheng; Tizhi Huang; Shaowen Qin; James Jang-Hun Yeh; Qiang Gao; Alan G. Chen; Chao-Pin Yeh; Austin V. Harton; Karl W. Wyatt
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Paper Abstract

This paper discusses material behaviors of holographic materials in terms of mechanical, thermomechanical properties and their effects on optical efficiency. Experiments were carried out to characterize coefficient of thermal expansion, stress strain curves, and dynamic mechanical behaviors of photopolymers. It has been found that in-plane deformation of photopolymer has a minimum effect on the diffraction efficiency while out-of-plane deformation can significantly contribute to the diffraction efficiency of holographic optical elements.

Paper Details

Date Published: 26 March 1998
PDF: 7 pages
Proc. SPIE 3294, Holographic Materials IV, (26 March 1998); doi: 10.1117/12.304509
Show Author Affiliations
Sean X. Wu, Motorola (United States)
Ching-Shan Cheng, Motorola (United States)
Tizhi Huang, Motorola (United States)
Shaowen Qin, Motorola (United States)
James Jang-Hun Yeh, Motorola (United States)
Qiang Gao, Motorola (United States)
Alan G. Chen, Motorola (United States)
Chao-Pin Yeh, Motorola (United States)
Austin V. Harton, Motorola (United States)
Karl W. Wyatt, Motorola (United States)


Published in SPIE Proceedings Vol. 3294:
Holographic Materials IV
T. John Trout, Editor(s)

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