Share Email Print
cover

Proceedings Paper

Hybridization, assembling, and testing of miniaturized optoelectronic modules for sensors and microsystems
Author(s): Harri K. Kopola; Pentti Karioja; Outi Rusanen; Heikki Lehto; Jorma Lammasniemi
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

This paper presents an overview of the research and development work on packaging and manufacturing different optoelectronic modules and microsystems for spectroscopic applications at VTT Electronics. Four different spectrometer concepts are analyzed: a multiwavelength detector module, an LED array spectrometer module, a PGP-spectrograph and an IR- spectrometer on silicon. The construction, main features, packaging concepts and performance are reviewed.

Paper Details

Date Published: 15 March 1998
PDF: 9 pages
Proc. SPIE 3276, Miniaturized Systems with Micro-Optics and Micromechanics III, (15 March 1998); doi: 10.1117/12.302409
Show Author Affiliations
Harri K. Kopola, VTT Electronics (Finland)
Pentti Karioja, VTT Electronics (Finland)
Outi Rusanen, VTT Electronics (Finland)
Heikki Lehto, VTT Electronics (Finland)
Jorma Lammasniemi, VTT Electronics (Finland)


Published in SPIE Proceedings Vol. 3276:
Miniaturized Systems with Micro-Optics and Micromechanics III
M. Edward Motamedi; Rolf Goering, Editor(s)

© SPIE. Terms of Use
Back to Top