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Proceedings Paper

Nonsilicon micromachining for MOEMS elements
Author(s): Yi-Xin Chen; Xiaolin Zhao; Zongguang Wang
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Paper Abstract

For many MEMS devices, silicon including polysilicon so far is the most idea materials, therefore the silicon micromachining technology has been well developed. However, for some MOEMS devices and systems, using other materials such as glasses, quartz, dielectric and ferroelectric crystals or ceramics, compound semiconductors, metals and alloys are also available or unique. As a result, it is necessary to develop the nonsilicon micromachining technology. In this paper, the nonsilicon micromachining process and some devices such as different kinds of micro- hinges will be reported.

Paper Details

Date Published: 15 March 1998
PDF: 8 pages
Proc. SPIE 3276, Miniaturized Systems with Micro-Optics and Micromechanics III, (15 March 1998); doi: 10.1117/12.302403
Show Author Affiliations
Yi-Xin Chen, Shanghai Jiao Tong Univ. (China)
Xiaolin Zhao, Shanghai Jiao Tong Univ. (China)
Zongguang Wang, Shanghai Jiao Tong Univ. (China)


Published in SPIE Proceedings Vol. 3276:
Miniaturized Systems with Micro-Optics and Micromechanics III
M. Edward Motamedi; Rolf Goering, Editor(s)

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