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Proceedings Paper

In-package active fiber optic micro-aligner
Author(s): John M. Haake; Robert L. Wood; Vijayakumar R. Dhuler
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Paper Abstract

We describe and demonstrate what we believe is the first 3- axis MEMS active fiber optic micro-aligner, which will allow for in-package alignment of fiber optic and micro-optic components. The micro-aligner is a wafer level fabricated device, based on a combination of silicon micromachining and LIGA technology. The electrically controllable actuators demonstrate the high force and displacement necessary to overcome fiber optic, counterforce springs, friction, and wirebonds to perform in-package alignment of a fiber optic. We have demonstrated movement of > 20 microns in all three axes in an in-package configuration. The first prototype device are currently small enough (4 X 4 X 0.5 mm3) to fit into a standard 14 pin butterfly package. We will show that future devices with the same forces and displacements can be made smaller than 1 X 1 X 0.5 mm3 thus allowing for multiple single mode fiber optic attachments inside a standard opto-electronic package.

Paper Details

Date Published: 15 March 1998
PDF: 13 pages
Proc. SPIE 3276, Miniaturized Systems with Micro-Optics and Micromechanics III, (15 March 1998); doi: 10.1117/12.302398
Show Author Affiliations
John M. Haake, The Boeing Co. (United States)
Robert L. Wood, Microelectronics Ctr. of North Carolina (United States)
Vijayakumar R. Dhuler, Microelectronics Ctr. of North Carolina (United States)


Published in SPIE Proceedings Vol. 3276:
Miniaturized Systems with Micro-Optics and Micromechanics III
M. Edward Motamedi; Rolf Goering, Editor(s)

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