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Proceedings Paper

Capacitive array sensors for process verification, moisture detection, and NDE of polymers and composites
Author(s): Eric S. Boltz; Timothy C. Tiernan; William F. Hartman
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Paper Abstract

A new capacitive array sensor has been developed for process verification and NDE of polymers and composites. Unlike existing dielectrometer technology, the new sensor incorporates several innovations to maximize sensitivity to material properties while minimizing the effects of temperature, humidity and electromagnetic interference. Conventional dielectric measurement systems require sensors to be embedded within a material and discarded after a single use. Furthermore, conventional sensors are so sensitive to environmental variables that cure monitoring is based solely on changes in the material ionic conductivity; no absolute measure of cure state is possible. The configuration of these new sensors greatly reduces sensitivity to environmental variables and permits external, rather than embedded, measurement making both post-process cure verification and NDE possible. Since the sensor is not discarded, the cost per measurement is greatly reduced.

Paper Details

Date Published: 31 March 1998
PDF: 9 pages
Proc. SPIE 3396, Nondestructive Evaluation of Materials and Composites II, (31 March 1998); doi: 10.1117/12.301520
Show Author Affiliations
Eric S. Boltz, TPL, Inc. (United States)
Timothy C. Tiernan, TPL, Inc. (United States)
William F. Hartman, TPL, Inc. (United States)

Published in SPIE Proceedings Vol. 3396:
Nondestructive Evaluation of Materials and Composites II
Steven R. Doctor; Carol A. Nove; George Y. Baaklini, Editor(s)

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