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Proceedings Paper

Photosensitive polyamic acid composition for an interlayer isolation of integrated circuits
Author(s): Nikolay G. Savinskij; Ludmila A. Tsvetkova; Polina G. Buyanovskaya
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Paper Abstract

Optimization of photosensitive composition, investigation of film formation conditions and improvement negative polyimide photoresist properties is accomplished. Polyimide photoresist is suggested for producing an interlayer dielectric coating in high density interconnected modules and passivation layers due to a good electrical insulation properties, planarization, high thermal and chemical stability.

Paper Details

Date Published: 1 January 1998
PDF: 5 pages
Proc. SPIE 3347, Optical Information Science and Technology (OIST97): Optical Recording Mechanisms and Media, (1 January 1998); doi: 10.1117/12.301408
Show Author Affiliations
Nikolay G. Savinskij, Institute of Microelectronics (Russia)
Ludmila A. Tsvetkova, Institute of Microelectronics (Russia)
Polina G. Buyanovskaya, Institute of Microelectronics (Russia)


Published in SPIE Proceedings Vol. 3347:
Optical Information Science and Technology (OIST97): Optical Recording Mechanisms and Media
Andrei L. Mikaelian, Editor(s)

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